Midziyo yemagetsi inoburitsa kupisa kana ichishanda.Kupisa hakusi nyore kuitisa kunze kwemichina, iyo inoita kuti kupisa kwemukati kwezvigadzirwa zvemagetsi kuwedzere nokukurumidza.Kana pane nguva dzose nzvimbo yekushisa yakakwirira, kushanda kwemagetsi emagetsi kuchakanganiswa uye hupenyu hwebasa huchaderedzwa.Kanisa kupisa uku kwakanyanyisa kunze.
Kana zvasvika pakupisa kupisa kurapa kwemidziyo yemagetsi, kiyi ndiyo yekupisa kupisa kurapa kwePCB redunhu board.Iyo PCB yedunhu bhodhi itsigiro yezvikamu zvemagetsi uye mutakuri wekubatanidza kwemagetsi kwezvikamu zvemagetsi.Nekuvandudzwa kwesainzi uye tekinoroji, michina yemagetsi iri kusimukira yakanangana nekubatana kwakanyanya uye miniaturization.Zviri pachena kuti hazvina kukwana kuvimba chete pamusoro pekupisa kwekupisa kwePCB redunhu bhodhi.
Paunenge uchigadzira chinzvimbo chePCB ikozvino bhodhi, injinjiniya yezvigadzirwa achafunga zvakawanda, senge kana mhepo ichiyerera, inoyerera kusvika kumagumo nekusagadzikana kushoma, uye marudzi ese emagetsi ekushandisa emagetsi ekushandisa anofanirwa kudzivirira kuisa mipendero kana makona, kuitira kudzivirira kupisa kubva pakuendeswa kunze nenguva.Mukuwedzera kune dhizaini yenzvimbo, zvinodikanwa kuisa zvikamu zvekutonhora zvemagetsi emagetsi epamusoro-simba.
Thermally conductive gap yekuzadza zvinhu ndeye inyanzvi interface gap inozadza thermal conductive zvinhu.Kana ndege mbiri dzakatsetseka uye dzakapfava dzichisangana, pachine mamwe mapundu.Mhepo iri mugomba inotadzisa kupisa conduction kumhanya, saka iyo thermal conductive gap yekuzadza zvinhu inozadzwa muradiator.Pakati penzvimbo yekupisa uye sosi yekupisa, bvisa mhepo iri mugomba uye uderedze iyo interface inobata kupisa kwekudzivirira, nekudaro uchiwedzera kukurumidza kwekupisa kupisa kune radiator, nekudaro kuderedza tembiricha yePCB redunhu bhodhi.
Nguva yekutumira: Aug-21-2023