LED chip
Midziyo yekutaurirana,
Nharembozha CPU,
Memory module,
IGBT
Power modules,
Simba semiconductor munda.
Mix Mutsa
Extrusion
Thermal Pad Production Line
Crop
Package
Outgoing Goods
Voltage Kuputsa Tester
Thermal Conductivity Tester
Kneader
Murabhoritari
Nekupisa kwakanaka kwekutamisa, panguva imwe chete nekuoma kwakasimba, kwete kusimba, kwete kunyunguduka, kusina kunaka uye kusina chepfu;
Yakanakisa thermal conductivity, ine yakaderera mafuta kupatsanurwa, yakakwira tembiricha mafuta, tembiricha haiyerere;
Yakanakisa insulation kuita, isina-chepfu uye isingaravike, hapana kurapa, hapana ngura kune substrate, makemikari uye emuviri zvimiro zvakagadzikana;
Yakakwira uye yakaderera tembiricha kuramba, kudzivirira kwemvura, ozone, mamiriro ekunze kuchembera kuramba, inogona kushandiswa munzvimbo yakakwirira uye yakaderera tembiricha kwenguva yakareba;
Yakanaka thixotropy, ine mwero kuenderana, nyore kushandisa, kupfeka kana kuisa chisimbiso maitiro ari nyore;
Iine yakanakisa magetsi ekudzivirira, uye yakanakisa thermal conductivity, panguva imwechete ine yakaderera mafuta kupatsanurwa (inosvika ku zero), yakakwirira uye yakaderera tembiricha kuramba, kudzivirira mvura, ozone, mamiriro ekunze kuchembera kuramba.
1. Good thermal conductivity: 1-15 W / mK.
2. Kuomarara kwakaderera: Kuomarara kunobva paShoer00 10~80.
3. Magetsi insulating.
4. Easy kuungana.
1. Zviviri-chikamu dispensable gap filler, mvura inonamira.
2. Thermal conductivity: 1.2 ~ 4.0 W / mK
3. High voltage insulation, high compression, yakanaka tembiricha kuramba.
4. Compression application, inogona kuwana otomatiki mashandiro.
1. Kuparadzaniswa kwemafuta mashoma (kusvika ku0).
2. Chimiro chenguva refu, kuvimbika kwakanaka.
3. Kuramba kwakasimba kwemamiriro ekunze (yakakwirira uye yakaderera tembiricha kuramba -40 ~ 150 ℃).
4. Kuramba kwehunyoro, ozone resistance, kuchembera kuramba.