Thermal ConductivePaste | |||
Property | Unit | Product Series | Test Method |
JOJUN-8350 | |||
Color |
| Gireyi | Visual |
Density | g/cc | 3.1 | ASTM D792 |
Extrusion Speed@30cc, 90psi | g/min | 10-90 |
|
ApplicationTembiricha | ℃ | -50 ~+200 |
|
Kupisa motoKirasi |
| V0 | UL94 |
ThermalConductivity | W/mK | 3.5 | ASTM D5470 |
BreakdownVoltage | KV/mm | >5 | ASTM D149 |
VolumeResistivity | ohm-cm | 10^13 | ASTM D257 |
DielectricConstant | 1MHz | 7 | ASTM D150 |
LED chip
Midziyo yekutaurirana,
Nharembozha CPU,
Memory module,
IGBT
Power modules,
Simba semiconductor munda.
Mix Mutsa
Extrusion
Thermal Pad Production Line
Crop
Package
Outgoing Goods
Voltage Kuputsa Tester
Thermal Conductivity Tester
Kneader
Murabhoritari
Zvakanaka kupisa conductivity : 9 W / MK
Zvinhu zviviri-zvikamu, zviri nyore kuchengeta;
Yakanakisa yakakwira uye yakaderera tembiricha michina zvivakwa uye kugadzikana kwemakemikari;
Nguva yekurapa inogona kugadziriswa maererano nekupisa.
Automatic midziyo inogona kushandiswa kugadzirisa ukobvu;
Inoshandiswa zviri nyore kune otomatiki mashandiro edhisheni system.
1. Good thermal conductivity: 1-15 W / mK.
2. Kuomarara kwakaderera: Kuomarara kunobva paShoer00 10~80.
3. Magetsi insulating.
4. Easy kuungana.
1. Zviviri-chikamu dispensable gap filler, mvura inonamira.
2. Thermal conductivity: 1.2 ~ 4.0 W / mK
3. High voltage insulation, high compression, yakanaka tembiricha kuramba.
4. Compression application, inogona kuwana otomatiki mashandiro.
1. Kuparadzaniswa kwemafuta mashoma (kusvika ku0).
2. Chimiro chenguva refu, kuvimbika kwakanaka.
3. Kuramba kwakasimba kwemamiriro ekunze (yakakwirira uye yakaderera tembiricha kuramba -40 ~ 150 ℃).
4. Kuramba kwehunyoro, ozone resistance, kuchembera kuramba.